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With over 500 single Bond Chambers and a total of more than 100 fully automated wafer bonding systems in the field of MEMS (Micro-Electro-Mechanical-Systems), ...
www.wafer-bonder.com - 2009-02-04
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EV Group (EVG) 3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed ...
www.3d-interconnect.com - 2009-02-10
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mems
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nanotechnology
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